FLIR Boson®+

Made in the USA, and ITAR-free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. Lower video latency enhances tracking, seeker performance, and decision support. Radiometry will be available in the first quarter of 2024 on 640 x 512 and 320 x 256 resolution models.

Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade. New models also include factory-integrated continuous zooms lenses to streamline development and maximize performance. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more. The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration. Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

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Made in the USA, and ITAR-free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness. Lower video latency enhances tracking, seeker performance, and decision support. Radiometry will be available in the first quarter of 2024 on 640 x 512 and 320 x 256 resolution models.

Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade. New models also include factory-integrated continuous zooms lenses to streamline development and maximize performance. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more. The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration. Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

  • Market-leading Thermal Sensitivity, Contrast, and LatencyNEDT of ≤20 mK extends detection, recognition, and identification (DRI) performance
  • Optimized Size, Weight, and Power (SWaP)Full-featured LWIR thermal camera module just 7.5 grams and less than 4.9 cm³
  • Plug-and-Play UpgradeShared mechanical, electrical, and video interface across all Boson models